HYPER SOLDERJt Musashi Dispenser is the first in the world to apply Solder paste.

In Jet Dispenser

1 million shots of φ100 μm

Can be applied stably

<Type 8φ100μm After 1 million shots>

Ag paste application is also supported

Three features of HYPER SOLDERJET

①New structure that does not contain particles

Our company's completely new structure was created by thoroughly investigating the cause of clogging solder. Ag paste and Au paste can also be applied stably.

②Not affected by step

It is also compatible with workpieces with steps and gaps that are difficult in the printing process.

③High-speed production is possible

High production capacity is achieved without the need for Nozzle up and down operation during application.